Reliable thermal management Loctite
- Superior thermal conductivity: You transfer heat away from power transistors and sensitive components directly into the heat sink.
- Consistent electrical insulation: The self-shimming formula maintains a uniform gap to deliver dependable electrical isolation between mating surfaces.
- Rapid cure without mixing: With the dedicated activator, you achieve fast room-temperature fixturing without needing to pre-mix any components.
With the Loctite 315 sf 7386 output electronics kit, you mount heat-sensitive electronic components directly to heat sinks or printed circuit boards with ease. This kit includes a 25 ml syringe of Loctite 315 thermally conductive adhesive and an 18 ml bottle of sf 7386 activator. By applying each product to opposite surfaces, the system cures rapidly at room temperature upon assembly without pre-mixing. Its self-shimming technology maintains a consistent 0.12 to 0.15 mm gap to guarantee dependable electrical insulation and efficient heat dissipation across a wide temperature range from -55 °C to +150 °C.
Product description:
- LOCTITE 315/LOCTITE SF 7386 KIT is a kit consisting of 2 parts, LOCTITE 315, a self-shimming thermally conductive adhesive for bonding electrical components to heat sinks with an insulating gap and LOCTITE SF 7386, an activator which cures Loctite adhesives.
- The kit is used to bond transformers, transistors and other heat generating electronic components to printed circuit boards.
- To view Technical Information for these products, please go to the pages for LOCTITE 315 and LOCTITE SF 7386.